LCC Image Sensors are packaged with up to 100 castellations (contacts). The ceramic substrate packaging presents new challenges for RoHS high temperature soldering.
Historically, Image Sensors are soldered directly on the printed circuit board (PCB). LCC Image Sensors require longer soldering times for RoHS high temperature solders. The ceramic substrate “expands” while the solder joint is “fixed” and cracks.
- Avoid color array high temperature soldering damage
- Avoid electrostatic discharge (ESD) production line problems.
- Avoid cleaning solutions clouding glass cover